Benson Nissan-Mazda-Northwest, Company

Flip-chip technology is so called because the package assembly is accomplished by inverting, or "flipping" the IC die to make connection with the substrate directly. Unlike conventional interconnection using wire bonding, I/O and power connections are made with solder or gold bumps. The bonding...

Quad-Flat, Non-leaded (QFN) plastic packages are considered CSPs because they are often no more than 20% larger than that actual chip built inside. They combine the simple construction and economy of leadframe-based packaging with the flexibility and density of matrix-array substrates. Because...

Fine-pitch BGA packages are near chip-size versions of the ball-grid array family, featuring smaller, thinner dimensions and flexible body size and pincount availability. They are assembled using shared tooling and common substrate panels allowing new package sizes to be created with far less cost...

BGAs are commonly used for graphics ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, and other logic and mixed signal applications and are found in all types of computers and electronic equipment. i2a Technologies' plastic and metal BGA package family...

Stacked-die packaging allows for very efficient use of mother-board real estate, reducing size and weight, as well as contributing to system level cost reduction. The technology also enables the flexibility of combining custom chips with off-the-shelf devices to further reduce total systems cost....

SiP technology combines multiple ICs, discrete and passives components onto a single package. This provides a complete functional system in one module that can be processed much like a standard component during board assembly. In contrast with System-on-Chip (SoC), where a single die is used, SiP...

i2a Technologies has developed the open-cavity plastic package (OCP) solution to provide standard packaging which allows access to the semiconductor die of prototype ICs. OCP options include all QFP and BGA package types and match the standard package outline and footprints from those families....

The need for high density, high performance, and cost effectiveness has sped up the development and use of multi-chip modules. Multi-chip modules enable the integration of different chips with varied functions into a mini substrate, instead of inserting individual packages onto a large PCB (also...

In wafer-level chip-scale packaging (WLCSP) technology, the "package", or interconnect elements, are fabricated on the wafer prior to singulation. This makes it different from all other package types in that there is no assembly to a substrate, and the singulated WLCSP is ready for SMT mounting....

QFP (Quad-Flat-Package) is the original surface mount package family which addresses the higher leadcounts of larger digital ICs, owing to its design using thin, fine-pitch leadframes and four-sided lead configuration. Flexible external leads provide high reliability of solder joints of mounted...